Yun Industrial / ACME PCB started offering Ball Grid Assembly (BGA) services back in 1994. Over the years we have gained extensive knowledge in BGA assembly with an X-Ray inspection machine. We are confident to say we can build you a high quality BGA assembly board.
Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. Ball Grid Array packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
BGAs, as they’re called, use the underside of the chip for connection to the board. This is in contrast to conventional chips, which utilize perimeter connections. This change results in more space for connection, increasing the performance of the PCB.
Other benefits of a ball grid array include:
- Less Thermal Resistance
- Better Performance at High Speeds
- Higher Reliability
More Advantages of Ball Grid Array
Ball grid arrays are a newer technology, that use tiny spheres of solder to form a connection instead of the average conventional wire pins. Which results in, there being several advantages to using BGAs, making them one of the more popular options in today’s marketplace.
Some of the advantages include:
Less Thermal Resistance
The silicon chip of a BGA has less thermal resistance than its quad flat package brethren. This results in faster heat dissipation from the integrated circuit to the PCB.
Performance at high speeds is better
Thanks to the connections on the bottom of the chip, they are shorter. This means faster speeds and higher performance.
The reliability is higher
Pins in a quad flat package are typically very thin and more fragile. Thus, damaged and bent pins are commonplace. When this damage occurs, repair is nearly impossible.
The solder pad connections of a BGA don’t run the same risk, giving you a more reliable connection.