Yun Industrial Features Ball Grid Array (BGA) Assembly

We provide Ball Grid Array (BGA) surface-mounts packaging (a chip carrier) used for integrated circuits.

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. Ball Grid Array packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.

Yun Industrial / ACME PCB began offering Ball Grid Array (BGA) Assembly services in 1994. Over these many year’s experience BGA assembly with X Ray inspection machine, right assembly procedure, we are very confident to say that we know, and we can build a high quality, good yield rate BGA assembly board.

Ball grid array packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA (Ball Grid Array) also replaces solder balls on the component underside for SMT mounting. Our assembly capabilities include BGA assembly and rework up to 65mm squared up to 36 layer printed circuit board.

“We began BGA placement on a project from D-Link Systems. Over time, we learned techniques and built experience with various types of BGA assembly jobs. Some of these included placing BGAs on both the top and bottom sides of the printed circuit board. We also developed the capability to place BGAs on both sides of the circuit board utilizing tin/lead as well as lead-free solders. This is a challenging process, but at Yun Industrial, we do it without a problem.”