Potting and Encapsulating Services
Yun Industrial ACME PCB Assembly offers low pressure molding solutions from design to production. We safely encapsulate your electronics to provide a water tight solution by injecting engineered adhesives around electronic assemblies, delicate wires, and connector sealing. We offer collaborative design engineering and prototyping.
After we install the electronic components on your PCB products we can then add a water resistant coating, available in silicone’s, polyurethanes and acrylics. This type of service is better known as potting service or encapsulating. Potting acts as an excellent barrier against moisture, dust and most environmental contaminants.
Low Pressure Injection Molding
Low Pressure Injection MoldingLow Pressure Injection Molding is cost effective, environmentally friendly process to encapsulate and protect components from the environment, including PCBs, sensors, switches, batteries, connectors, etc. Yun Industrial ACME PCB Assembly offers low pressure molding, which is an environmentally friendly process that is positioned between potting and injection molding technologies.
Why Low Pressure Molding?
Why Low Pressure Molding?Low pressure molding offers a precise design allowing for more space and flexibility within the final assembled product, as well as, allowing for design capabilities beyond the form fit function of traditional materials. Skylining allows for the use of less material, which creates a precise encapsulation for a lighter weighing product.
Types of Low Pressure Molding
This is a great cost-saving solution that will eliminate the need for a housing, it reduces capital investment costs, provides quick cycle times and protects fragile components.
Wire Harness Strain Relief
Low Pressure Molding is the chosen method to protect delicate fine-pitch connector assemblies. It also can provide strain relief within the same application. The process is flexible and requires low capital investment.
Low Pressure Molding provides environmental protection from dust, moisture and vibration, and adheres to LED lenses. Molding can be done with the LED lens exposed or completely encapsulated.
Molding switches can be challenging because of the small size and thin, delicate side walls. Low Pressure Molding reduces complexity by removing the two-component thermoset curing process.
Low Pressure Molding reduces failure rates compared to traditional potting, particularly critical in the mobile phone battery industry.
Low Pressure Molding offers huge benefits to the connector industry because of the low molding pressures.