WHAT IS LOW PRESSURE MOLDING? Low pressure molding is a one-step process that encapsulates, and seals to protect electronics. By using a simple mold set allows for the process to use a lot less material than the traditional potting and eliminate the housing. Your companies part numbers and logos can easily be incorporated into the … Read more
Are you looking to reduce the size of your chip carrier while enhancing its functionality and performance? Ball Grid Array (BGA) packaging may be the solution you need. As a widely adopted surface mount technology (SMT), BGA is becoming increasingly popular in modern electronics manufacturing for its ability to maximize connection density and optimize PCB … Read more
Can a Rigid Printed Circuit Board Include Both Surface Mount and Thru-Hole Technology? When engineers design a rigid printed circuit board (PCB), one of the key decisions they face is choosing the right assembly method. In today’s fast-paced electronics industry, Surface Mount Technology (SMT) dominates due to its compact footprint, cost-efficiency, and performance. But what … Read more
Transition your new product from concept and design to volume production. New Product Introduction is a challenging phase in a product’s life cycle. Yun Industrial / ACME PCB provides the breadth of services and experience to smoothly transition your new product from concept and design through to volume production. We want to be your assembly … Read more
The Benefits of PCB Manufacturing and Turn-key Assembly in California and the USA In today’s fast-paced electronics industry, companies are constantly looking for ways to optimize production, cut costs, and improve product quality. This is where Turnkey PCB Manufacturing and Assembly in the USA comes in as a game-changing solution. Unlike traditional PCB assembly, which … Read more
Yun Industrial specializes in Surface-Mount Technology (SMT) to apply components to the surface of PCBs. Keep in mind, you will need to do your homework before you move forward in switching an existing electronic product design from through-hole technology to surface mount technology (SMT). Surface-mount technology (SMT) is a method for producing electronic circuits in which the components … Read more
BGA Assembly (Ball Grid Array Assembly) plays a critical role in modern electronics manufacturing, offering a reliable and efficient way to mount integrated circuits onto printed circuit boards (PCBs). As electronic devices continue to shrink in size while increasing in functionality, the demand for compact and high-performance components has driven the widespread adoption of Ball … Read more
We Can Re-Work Ball Grid Array Performance may suffer in mass produced Ball Grid Array (BGA) devices due to many different reasons. Defects in the device, lack of or excess solder joints, or oversights during upgradation processes can be included as one of the may reasons for performance issues. These irregularities can be resolved with … Read more
A lot of times most entrepreneurs and manufacturers think the old ways of manufacturing electronics and printed circuit board manufacturing can be very intimidating because it is a slow process that can be prone to errors, and also expensive, which makes people hesitant to use it. Electronic turn-key assembly manufacturing wasn’t designed for small batch … Read more
Yun Industrial is working to meet the growing demand for tabletop “box builds” we have a dedicated team for each department, including covering the purchasing, electronics engineering, contract manufacturing services, and testing. Our team will support all your electro-mechanical projects from the initial stages of design conception and prototyping through volume production. Yun Industrial provides … Read more