A Ball Grid Array or (BGA) is a SMT (Surface Mount Technology) package that is most commonly used for Integrated Circuits (ICs) with a large number of pins. Ball grid array packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. With it being a high-density and … Read moreYun Industrial / ACME PCB Offers BGA Assembly Technology
Printed Circuit Boards (PCBs) are the backbone of modern electronics, from consumer gadgets to industrial machinery. Without the right design practices, even the best components can fail to perform efficiently. At YIC Assembly, we work with the latest in PCB technology and design principles to ensure reliability, durability, and cost-efficiency for all types of electronics. … Read morePCB Design Best Practices: Tips from the Experts
Top Benefits of Using High-Quality PCBs in Your Projects Printed circuit boards (PCBs) are at the heart of modern electronics, playing a critical role in the functionality and efficiency of countless devices. Whether you’re developing consumer electronics, industrial equipment, or innovative tech solutions, using high-quality PCBs can make a significant difference in your project’s success. … Read moreTop Benefits of Using High-Quality PCBs in Your Projects
In the fast-paced world of electronics, printed circuit boards (PCBs) are at the heart of nearly every device. From smartphones and computers to industrial machinery and medical equipment, PCBs play a critical role in enabling the functionality of electronic products. Understanding the process of PCB prototyping and its importance in product development is crucial for … Read moreUnderstanding PCB Prototyping and Its Importance in Product Development for Printed Circuit Boards
In the ever-evolving world of electronics, the role of printed circuit boards (PCBs) is fundamental. They are the backbone of nearly every electronic device, from simple household appliances to complex industrial machinery. The process of PCB assembly is intricate and requires a high level of precision and expertise. One of the most crucial aspects that … Read moreThe Importance of Quality Control in PCB Assembly
Surface Mount Technology (SMT) vs. Through-Hole Technology: Understanding the Difference In the realm of electronic manufacturing, two predominant methods are used to mount components onto printed circuit boards (PCBs): Surface Mount Technology (SMT) and Through-Hole Technology. Both have distinct advantages and applications, making them suitable for different types of electronic assemblies. Understanding these differences can … Read moreSurface Mount Technology (SMT) vs. Through-Hole Technology: Understanding the Difference
Quick turn is imperative when it comes to PCB fabrication. Quick go-to-market can be a large source of having a competitive advantage. At Yun Industrial we tend to place a great deal of importance when it comes to providing a prompt delivery service of your order, while complying with all quality control and certification measures. … Read moreQuick Turn PCB Prototype Assembly in the USA
SMT Assembly vs. Through-Hole Assembly When you start looking for printed circuit board assembly vendors, you’ll notice that many vendors (including Yun Industrial Acme PCB Assembly) offer two primary types of assembly: SMT assembly and Through-Hole assembly (also called Thru-Hole assembly). These refer to the way that components are mounted on the printed circuit board. … Read moreComparing SMT Assembly to Through-Hole Assembly
WHAT IS LOW PRESSURE MOLDING? Low pressure molding is a one-step process that encapsulates, and seals to protect electronics. By using a simple mold set allows for the process to use a lot less material than the traditional potting and eliminate the housing. Your companies part numbers and logos can easily be incorporated into the … Read moreUnderstanding Low Pressure Molding?
Do you want to reduce the package size of your chip carrier and get more functionality from each of your chip modules? Then consider ball grid array (BGA) packaging. BGA is a surface mount technology that is rapidly growing in popularity among manufacturers. This packaging technique utilizes the underside of a chip package for greater … Read moreWhy You Should Consider Ball Grid Array Packaging