The Benefits of PCB Manufacturing and Turn-key Assembly in California and the USA In today’s fast-paced electronics industry, companies are constantly looking for ways to optimize production, cut costs, and improve product quality. This is where Turnkey PCB Manufacturing and Assembly in the USA comes in as a game-changing solution. Unlike traditional PCB assembly, which … Read moreTurnkey PCB Manufacturing and Assembly in the USA
Yun Industrial specializes in Surface-Mount Technology (SMT) to apply components to the surface of PCBs. Keep in mind, you will need to do your homework before you move forward in switching an existing electronic product design from through-hole technology to surface mount technology (SMT). Surface-mount technology (SMT) is a method for producing electronic circuits in which the components … Read moreProviding Surface-Mount Technology
BGA Assembly (Ball Grid Array Assembly) plays a critical role in modern electronics manufacturing, offering a reliable and efficient way to mount integrated circuits onto printed circuit boards (PCBs). As electronic devices continue to shrink in size while increasing in functionality, the demand for compact and high-performance components has driven the widespread adoption of Ball … Read moreUnderstanding BGA Assembly: A Key Technology in Modern Electronics
We Can Re-Work Ball Grid Array Performance may suffer in mass produced Ball Grid Array (BGA) devices due to many different reasons. Defects in the device, lack of or excess solder joints, or oversights during upgradation processes can be included as one of the may reasons for performance issues. These irregularities can be resolved with … Read moreRefurbishing and Repairing Ball Grid Arrays to Help Save You Money
A lot of times most entrepreneurs and manufacturers think the old ways of manufacturing electronics and printed circuit board manufacturing can be very intimidating because it is a slow process that can be prone to errors, and also expensive, which makes people hesitant to use it. Electronic turn-key assembly manufacturing wasn’t designed for small batch … Read moreElectronic Turn-Key Assembly Manufacturing in the USA
Yun Industrial is working to meet the growing demand for tabletop “box builds” we have a dedicated team for each department, including covering the purchasing, electronics engineering, contract manufacturing services, and testing. Our team will support all your electro-mechanical projects from the initial stages of design conception and prototyping through volume production. Yun Industrial provides … Read moreUnderstanding How Box Builds Work and What They Are Used For
In the ever-evolving landscape of technology, electronic manufacturing plays a pivotal role in shaping how the world connects, communicates, and innovates. With advancements emerging at breakneck speed, it’s vital to understand the trends that will redefine the future of this industry. Companies like YIC Assembly are at the forefront of these changes, leveraging cutting-edge techniques … Read moreThe Future of Electronic Manufacturing: Innovations to Watch
Understanding Silk Screen Technology in Printed Circuit Board (PCB) Adding the silkscreen layer onto a printed circuit board is the final step in the fabrication process. Silkscreen is a layer that uses ink traces to identify all the PCB board components, test points, parts of the PCB, warning symbols, logos and marks etc. These shapes, … Read moreUnderstanding Silk Screen Technology in Printed Circuit Board (PCB)
Yun Industrial / ACME PCB started offering Ball Grid Assembly (BGA) services back in 1994. Over the years we have gained extensive knowledge in BGA assembly with an X-Ray inspection machine. We are confident to say we can build you a high quality BGA assembly board. Soldering of BGA devices requires precise control and is … Read moreBall Grid Assembly (BGA) and Integrated Circuits
A Ball Grid Array or (BGA) is a SMT (Surface Mount Technology) package that is most commonly used for Integrated Circuits (ICs) with a large number of pins. Ball grid array packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. With it being a high-density and … Read moreYun Industrial / ACME PCB Offers BGA Assembly Technology