What You Need to Include in Your Bill of Materials for Your PCB Assembly Service Provider Are you putting in your first order with a new PCB assembly service provider? One of the most important documents in this exchange will be your bill of materials (BOM). A bill of materials will tell your PCB manufacturer … Read moreYour Bill of Materials for Your PCB Assembly Service Provider
At Yun Industrial Acme PCB Assembly, our primary focus is assembling printed circuit boards for our clients, but we also offer a variety of add-on services that can save our clients time and money. These add-on services naturally fit within the realm of what we are already doing and play to the natural strengths of … Read moreWhy Consider Choosing Our Add-On Services?
SMT Assembly vs. Through-Hole Assembly When you start looking for printed circuit board assembly vendors, you’ll notice that many vendors (including Yun Industrial Acme PCB Assembly) offer two primary types of assembly: SMT assembly and Through-Hole assembly (also called Thru-Hole assembly). These refer to the way that components are mounted on the printed circuit board. … Read moreComparing SMT Assembly to Through-Hole Assembly
How to Create an Electronic Prototype Do you have a big idea for a new electronic product? We all know that ideas are a dime a dozen, so if you really want to get your idea off the ground, eventually you’ll need to create a prototype. A prototype, simply put, is a physical manifestation of … Read moreHow to Create an Electronic Prototype
WHAT IS LOW PRESSURE MOLDING? Low pressure molding is a one-step process that encapsulates, and seals to protect electronics. By using a simple mold set allows for the process to use a lot less material than the traditional potting and eliminate the housing. Your companies part numbers and logos can easily be incorporated into the … Read moreUnderstanding Low Pressure Molding?
Do you want to reduce the package size of your chip carrier and get more functionality from each of your chip modules? Then consider ball grid array (BGA) packaging. BGA is a surface mount technology that is rapidly growing in popularity among manufacturers. This packaging technique utilizes the underside of a chip package for greater … Read moreWhy You Should Consider Ball Grid Array Packaging
Wetting issues are classified by Non-wetting and Dewetting. Non-wetting can be defined by saying it has the inability of molten solder to form a metallic bond with the base metal. This makes it so the PCB pads or the component’s terminals not catching the solder during the reflow process. Dewetting is a condition that results … Read moreAre you experiencing SMT Non-Wetting Issues?
Can a Rigid Printed Circuit Board Include Surface Mount Technology and Thru-Hole Technology? In previous blog posts, we’ve explained the difference between surface mount technology (SMT) and thru-hole technology. The vast majority of rigid printed circuit boards (PCBs) use surface mount technology, because SMT components are smaller than thru-hole components and can be mounted on … Read moreSurface Mount Technology and Thru-Hole Technology?
Why Consider Using Through Hole Printed Circuit Boards? In the printed circuit board business, there are two primary ways to mount components onto the circuit board: through-hole mounting and surface mounting. Through-hole mounting is the older technology and requires the circuit board manufacturer to drill holes through the PCB and place leads into the holes. … Read moreWhy Consider Using Through Hole Printed Circuit Boards?
What You Can Learn About a Vendor By Its Previous Customers Working with a brand new vendor can be risky. So can working with a vendor that hasn’t taken on a client as big or as demanding as you. After all, you don’t want to be the company that forces your vendor to confront brand … Read moreWhat You Can Learn About a Vendor By Its Previous Customers