When working with a new PCB Assembly Service Provider, one of the most critical documents you will prepare is the Bill of Materials (BOM). This document outlines every component necessary to assemble your printed circuit board, serving as the foundation for accurate quoting, ordering, and production. Errors in the BOM can result in costly delays, … Read more
As electronics become more compact and powerful, manufacturers are constantly looking for efficient ways to build reliable and high-performance circuit boards. One of the most important advancements in this area is Surface Mount Technology (SMT)—a method that has revolutionized PCB manufacturing by making assembly faster, more cost-effective, and scalable. At YIC Technologies, we specialize in … Read more
In today’s fast-paced world of technology, electronic devices are getting smaller, faster, and more powerful. Behind the scenes, one key player in making these advancements possible is BGA Assembly (Ball Grid Array Assembly). At YIC Assembly, we specialize in BGA Assembly for high-performance electronics, helping our customers bring innovative products to life. What Is BGA … Read more
Got a big idea for the next great electronic product? We all know that ideas are a dime a dozen—but turning that idea into a market-ready product takes planning, skill, and, most importantly, a prototype. A prototype is the first tangible version of your invention, and it’s an essential step on the road to success. … Read more
WHAT IS LOW PRESSURE MOLDING? Low pressure molding is a one-step process that encapsulates, and seals to protect electronics. By using a simple mold set allows for the process to use a lot less material than the traditional potting and eliminate the housing. Your companies part numbers and logos can easily be incorporated into the … Read more
Are you looking to reduce the size of your chip carrier while enhancing its functionality and performance? Ball Grid Array (BGA) packaging may be the solution you need. As a widely adopted surface mount technology (SMT), BGA is becoming increasingly popular in modern electronics manufacturing for its ability to maximize connection density and optimize PCB … Read more
Wetting issues in PCB assembly can significantly impact the quality and reliability of solder joints. These issues are generally classified into two categories: Non-wetting and Dewetting. Both conditions can lead to defective connections and reduced circuit performance if not properly identified and corrected. What Is Non-Wetting? Non-wetting occurs when molten solder fails to bond with … Read more
Yun Industrial Acme Printed Circuit boards offers the top-quality and technology in the manufacturing and testing of printed circuit board assembly. We also X-ray inspect all of our products, this technique is widely used in PCB assembly in order to maintain excellent quality in their products. Automated X-ray inspection (AXI) is a technology based on the same principles … Read more
Can a Rigid Printed Circuit Board Include Both Surface Mount and Thru-Hole Technology? When engineers design a rigid printed circuit board (PCB), one of the key decisions they face is choosing the right assembly method. In today’s fast-paced electronics industry, Surface Mount Technology (SMT) dominates due to its compact footprint, cost-efficiency, and performance. But what … Read more
Understanding Flexible Circuits: Applications and Advantages Flexible circuits, also known as flex circuits or flex PCBs, are widely used as connectors in applications where flexibility, space savings, or construction constraints limit the use of traditional rigid circuit boards or hand wiring. These circuits are designed to bend, twist, and fold, making them ideal for compact, … Read more