Are you experiencing SMT Non-Wetting Issues?
Wetting issues are classified by Non-wetting and Dewetting. Non-wetting can be defined by saying it has the inability of molten solder to form a metallic bond with the base metal. This makes it so the PCB pads or the component’s terminals not catching the solder during the reflow process. Dewetting is a condition that results … Read moreAre you experiencing SMT Non-Wetting Issues?