Do you want to reduce the package size of your chip carrier and get more functionality from each of your chip modules? Then consider ball grid array (BGA) packaging. BGA is a surface mount technology that is rapidly growing in popularity among manufacturers. This packaging technique utilizes the underside of a chip package for greater connectivity. BGA allows manufacturers to fit more interconnection pins on the surface of the packaging, which results in better performance of the chip carrier.
BGA also allows for a more overall efficient usage of the space of printed circuit boards and better soldering. Since BGAs reduce package size, this allows for printed circuit boards to be thinner and lighter, something manufacturers are always looking for.
TYPES OF BALL GRID ARRAYS
There are three types of BGAs:
- Plastic ball grid array (PBGA)
- Ceramic Ball grid array (CBGA)
- Tape Ball grid array (TBGA)
Each type has its benefits and detriments. Knowing the strengths of each is critical to maximizing the performance of a PCB.
PBGAS
- Low cost
- Superior electrical performance
- Excellent thermal compatibility with PCBs
- Sensitive to humidity
CBGAS
- Excellent heat dissipation, packaging density
- Higher cost
- Bad thermal compatibility with PCBs
TBGAS
- Excellent thermal compatibility with PCBs
- Lowest cost
- Best heat dissipation
- Sensitive to humidity
- Low dependability
With the connections hidden beneath the chip, ball grid arrays typically enlist X-ray inspection to examine the board quality. It’s the only way to detect defects such as:
- Voids
- Shorts circuits
- Missing solder balls
These are just some of the reasons that BGA may be preferable to quad flat pack style packages.
At YUN Industrial/ACME PCB, we have been offering BGA packaging for printed circuit boards since 1994!
Contact us today to learn more about this technique and whether it is right for your PCB order.